| 軟件備注： | 本文從元件選擇、電路設(shè)計和印制電路板的布線等幾個方面討論了電路板級的電磁兼容性(EMC)設(shè)計。主要內(nèi)容包括：電磁兼容性概述、元件選擇和電路設(shè)計技術(shù)、印制電路板的布線技術(shù)等。
參考文獻
1. System Design and Layout Techniques for Noise Reduction in
MCU-Based Systems, Motorola Application Note, AN1259.
2. Determining MCU Oscillator Start-up Parameters,
Motorola Application Note, AN1783.
3. Resetting Microcontrollers During Power Transitions,
Motorola Application Note, AN1744.
4. Resetting MCUs, Motorola Engineering Bulletin, EB413.
5. Trends in EMC Testing of Household Appliances,
SCHAFFNER Application Note, SAN014.
6. EMC at Component and PCB Level,
Martin O’Hara, Newnes, 1998.
7. Printed Circuit Board Design Techniques for EMC Compliance,
Mark I. Montrose, IEEE press series, 2000.
進一步信息，請參照英文原文《Designing for Board Level Electromagnetic Compatibility》編號AN2321/D，具體鏈接為 http://www.freescale.com/files/microcontrollers/doc/app_note/AN2321.pdf。 |
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