德州儀器公司（TI）提供創(chuàng)新的DSP和模擬技術(shù)，以滿足客戶在現(xiàn)實世界中信號處理的需要。除半導(dǎo)體之外，公司的業(yè)務(wù)還包括教育產(chǎn)品。TI總部位于美國得克薩斯州的達(dá)拉斯，在全球超過25個國家設(shè)有制造、研發(fā)或銷售機(jī)構(gòu)。如果需要了解更詳細(xì)的情況，請訪問德州儀器中國網(wǎng)址：www.ti.com.cn.

隨著德州儀器公司在中國市場的飛速發(fā)展，我們誠聘以下職位：

1. Automotive MSA Business Development Manager
 (located in Shanghai)

Role Summary

In this role as Automotive MSA Business Development Manager, you will take part in growing TI's Mix Signal Automotive products market share in China's fast growing automotive markets. You will promote TI's MSA based, Power management, CAN/LIN bus, LED drivers and other products to multiple solutions in automotive applications, such as, auto entertainment, auto dashboard applications, RFID applications, as well as automotive safety. In general, this role will be focused on helping customers understand which Analog products are best for their application and help work out solutions to support customers smoothly design in devices for production. Other functions will include training sales channels and taking care market events.

Primary Responsibility

To increase market share by DIN/DWIN customer activity of TI's MSA devices into China Automotive Applications
Building TI's local brand name in China through marketing activities & customer promotion
Helping the sales force see the value of TI's MSA devices in automotive applications
Work with the US Business Unit to drive a strategy to win China's fast growing automotive environment through technical feedback on future device needs
Help lead local FAE support to concentrate on top potential winning businesses and customers

Qualifications

BS in Electronic Engineering
+3-5 years' Analog R&D engineer
+3 years semiconductor marketing / BD experience, automotive market experience is requested.
Able to technically discuss customer device and total system requirements
Good Ability to communicate in English
Willing to take challenges and work independently
Aggressive personality
Excellent Chinese communication skills
Hard working and a team player

2. CI DSP Software Engineer (located in Shanghai)

Primary Responsibility
The DSP software engineer will engage in the development of PHY layer base station software based on TI DSP platform. The near term focus will be the development of LTE functional library.

As CI DSP SW engineer, he/she will develop software based on TI high performance DSP products such as C64x+ DSP. He/she needs to comply with TI software development procedure and deliver the software products within required schedule. He/she needs to develop the related documents based on TI software development requirements throughout the whole software development.

He/she has obligation to support field applications engineers and analyze/fix the bugs in the software based on customers and FAE’s feedbacks. CI DSP SW engineer must comply with the related Export Control regulation.

The engineer is also expected to engage system solution discussions with customers, promoting TI hardware and software solutions.

Qualifications
Personal characteristics/skills
Results-driven
Proactive and Passionate
Team play
Good communicating skill
English communication ability
Hard working

Minimal qualifications
3 years work experience as a software programmer
Well versed in C language programming
Working knowledge of TI C6000 DSP architecture
Programming experience of TI DSP peripherals such as Timer and EDMA
Working knowledge of DSP BIOS and real-time programming
Familiar with at least one of the following wireless standards, WCDMA, WiMax, LTE or TD-SCDMA
Working knowledge of software product development life cycle
Experience of trouble shooting software bugs

Desirable skills, experience and qualifications
C64x+ Assembly Language programming skill
C64x+ intrinsic programming skill
Experience in developing DSP framework for commercial software
MAC layer software development experience
Master degree in EE or computer engineering

3. ASIC Design Engineer
(located in Shenzhen or Shanghai)

Primary Responsibility
Be responsible for physical design of large, complex CMOS chips. Tasks including floor plan, partition, power routing, place & route, static timing analysis, DRC/LVS and other physical verification.
Work with customer design team early in design phase to define good design strategies.
Provide feedback and work closely with product development teams to improve design flow.
Coordinate and work with world wide design teams to ensure on time delivery of design results.

Qualifications
Bachelor degree or above in EE major
Minimum 3 year related experience with a solid IC design and EDA tool background
Solid understanding of deep sub-micron signal integrity issues such a cross-talk, IR drop, etc
Capable of handling multiple tasks at one time
Experienced in place & route, static timing analysis, synthesis
Extensive knowledge and experience with Magma, or Synopsys place & route tools
Extensive knowledge and experience with Synopsys DC, PT and PTSI tool
Experience with Perl, tcl scripting
Good customer communication skill is a must
Good command of English
Good command of Unix

If you enjoy working as a team member in Texas Instruments, you will have many opportunities for success. If you have got what it takes, you have earned the right to apply. Submit a Resume inclusive of both Chinese and English version and detail contacts to the following address:

上海市黃浦區(qū)南京西路128號永新廣場11層
德州儀器半導(dǎo)體技術(shù)（上海）有限公司上海分公司 人力資源部 (請在遞交的簡歷上注明所申請的職位)
郵編:200003
E-mail: china-recruiting@ti.com