HSP Field Application Engineer
(located in Shenzhen)

德州儀器公司（TI）提供創(chuàng)新的DSP和模擬技術，以滿足客戶在現實世界中信號處理的需要。除半導體之外，公司的業(yè)務還包括教育產品。TI總部位于美國得克薩斯州的達拉斯，在全球超過25個國家設有制造、研發(fā)或銷售機構。如果需要了解更詳細的情況，請訪問德州儀器中國網址：www.ti.com.cn.

隨著德州儀器公司在中國市場的飛速發(fā)展，我們誠聘以下職位(請在遞交的簡歷上注明所申請的職位) ：

Role Summary
Signal Chain technical support for china local telecom customers.

Primary Responsibility

Technically support high speed analog products (HSP) - wireless infrastructure (WI) products to key telecom customers
Drive Din-DWIN execution of key WI projects
Understand competition and update to respective business unit
Be involved in expertise buildup and new product definition
To certain extent, play the business development role for HSP products

Qualifications

Bachelor or Master of EE
At least 3 years' telecom working experience
Clear understanding of major wireless infrastructure radio standards: WCDMA/TD-SCDMA/CDMA2000/WiMAX/GSM/LTE
Familiar with wireless radio system design trade offs: heterodyne vs. direct conversion; frequency translation, with system design experience is a plus
Background in digital signal processing especially digital filter design
Knowledge of power amplifier digital-pre-distortion/Crest factor reduction
Major DAC specs. Interpolated DACs vs. Non-interpolated DACs. Tx side band suppression, carrier suppression
Major ADC specs. High IF sampling, ADC main care about, aliasing, image rejection, clocking consideration
Familiar with Matlab / C or C++ programming

If you enjoy working as a team member in Texas Instruments, you will have many opportunities for success. If you have got what it takes, you have earned the right to apply. Submit a Resume inclusive of both Chinese and English version and detail contacts to the following address:

上海市黃浦區(qū)南京西路128號永新廣場11層
德州儀器半導體技術（上海）有限公司上海分公司  人力資源部
郵編:200003
E-mail: china-recruiting@ti.com