【產(chǎn)通社，10月18日】SEMI日前發(fā)布五項新的半導(dǎo)體制造技術(shù)標(biāo)準(zhǔn)。這些標(biāo)準(zhǔn)由來自設(shè)備與材料供應(yīng)商、器件制造商以及其他參與SEMI國際標(biāo)準(zhǔn)項目廠商的技術(shù)專家們開發(fā)制定，可通過購買CD-ROM或在SEMI網(wǎng)站上下載獲得。

SEMI標(biāo)準(zhǔn)每三年發(fā)布一次。這些新的專利作為2008年11月版的一部分，加入到過去35年中SEMI已發(fā)布的775個標(biāo)準(zhǔn)中。

“這些新的SEMI標(biāo)準(zhǔn)是基于產(chǎn)業(yè)專家們的合作與共識而制訂的�！盨EMI國際標(biāo)準(zhǔn)主管James Amano說道，“這些標(biāo)準(zhǔn)的執(zhí)行將幫助廠商應(yīng)對日益增加的制造挑戰(zhàn)，改善收益率，并實現(xiàn)設(shè)備工藝的全球化兼容�！�

五項標(biāo)準(zhǔn)分別是：
SEMI E139.3     XML/SOAP Binding for Recipe and Parameter Management(配方和參數(shù)管理的XML/SOAP結(jié)合)
SEMI G87     Specification for Plastic Tape Frame for 300 mm Wafer(300mm晶圓塑料帶框規(guī)格)
SEMI M73     Test Methods for Extracting Relevant Characteristics from Measured Wafer Edge Profiles(由標(biāo)準(zhǔn)晶圓邊緣提取相關(guān)特征的測試方法)
SEMI M74     Specification for 450 mm Diameter Mechanical Handling Polished Wafers(450mm拋光晶圓機(jī)械搬運規(guī)格)
SEMI T20     System Architecture for Preventing/Detecting Semiconductor Counterfeit Products(半導(dǎo)體仿冒品防止/探測系統(tǒng)架構(gòu))

SEMI Announces Five New Technical Standards

New Specifications Address Cycle Time Reduction, Counterfeit Prevention

SAN JOSE, Calif.  October 6, 2008 ? SEMI has published five new technical standards applicable to the semiconductor manufacturing industry. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org.
SEMI Standards are published three times a year. The new standards, part of the November 2008 publication cycle, join more than 775 standards that have been published by SEMI during the past 35 years.

“These new SEMI standards, which include specifications to address counterfeiting of products in the semiconductor manufacturing supply chain, are the result of collaborative, consensus-driven efforts among industry experts,” said James Amano, Director, SEMI International Standards. “Their implementation will help manage the ever increasing manufacturing challenges, improve yield and ensure compatibility of equipment and processes worldwide.”

The full list of SEMI standards being released include:

SEMI E139.3
XML/SOAP Binding for Recipe and Parameter Management

SEMI G87
Specification for Plastic Tape Frame for 300 mm Wafer

SEMI M73
Test Methods for Extracting Relevant Characteristics from Measured Wafer Edge Profiles

SEMI M74
Specification for 450 mm Diameter Mechanical Handling Polished Wafers

SEMI T20
System Architecture for Preventing/Detecting Semiconductor Counterfeit Products

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays, photovoltaic systems and micro-electromechanical systems (MEMS).

About 1,650 volunteers worldwide participate in the program, which is made up of 18 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards.

About SEMI:
SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org