【產(chǎn)通社，12月29日訊】美國(guó)半導(dǎo)體科技研發(fā)聯(lián)盟（Semiconductor Manufacturing Technology，Sematech）官網(wǎng)消息，其旗下的3D Enablement Center (3DEC)與美國(guó)半導(dǎo)體產(chǎn)業(yè)協(xié)會(huì)(SIA)、Semiconductor Research Corp. (SRC)，日前共同定義出了wide I/O DRAM之后的未來(lái)3D芯片(3D IC)技術(shù)殺手級(jí)應(yīng)用，以及將遭遇的挑戰(zhàn)。

Sematech表示，上述單位的眾學(xué)者專(zhuān)家經(jīng)過(guò)討論之后，定義出異質(zhì)運(yùn)算(heterogeneous computing)、內(nèi)存、影像(imaging)、智能型感測(cè)系統(tǒng)(smart sensor systems)、通訊交換器(communication switches)，以及電力輸送/調(diào)節(jié)(power delivery/conditioning)等幾項(xiàng)頗具潛力的未來(lái)殺手級(jí)應(yīng)用技術(shù)；而與這些應(yīng)用相關(guān)的技術(shù)挑戰(zhàn)，則包括：降低3D芯片架構(gòu)成本、系統(tǒng)/架構(gòu)之先導(dǎo)(pathfinding)、通用的異質(zhì)多裸晶堆棧測(cè)試問(wèn)題以及散熱管理。

Sematech總裁暨執(zhí)行長(zhǎng)Dan Armbrust表示，“克服下一代應(yīng)用的共同技術(shù)挑戰(zhàn)，是加速 3D芯片技術(shù)推廣的關(guān)鍵。Sematech旗下的3DEC在相關(guān)合作研發(fā)計(jì)劃中的下一階段目標(biāo)，是針對(duì)這些共同的技術(shù)挑戰(zhàn)，提供可用的基礎(chǔ)架構(gòu)�！�

Sematech指出，在wide I/O DRAM問(wèn)世之后，市場(chǎng)的高需求、以及各種證實(shí)3D整合優(yōu)勢(shì)的大量應(yīng)用，將驅(qū)動(dòng)產(chǎn)業(yè)界對(duì)3D芯片技術(shù)更進(jìn)一步的研發(fā)；那些優(yōu)勢(shì)包括了較低的功耗、較高的性能，功能性的增加以及較低成本。

自2011年1月以來(lái)，Sematech的3DEC率先投入3D芯片標(biāo)準(zhǔn)與規(guī)格的開(kāi)發(fā)；為了迎接未來(lái)3D整合芯片與系統(tǒng)的時(shí)代，3DEC定義出3-5年內(nèi)可見(jiàn)的相關(guān)殺手級(jí)應(yīng)用與共同技術(shù)挑戰(zhàn)，以便為wide I/O DRAM之后的3D芯片技術(shù)鋪平道路。

3D芯片技術(shù)的發(fā)展已經(jīng)來(lái)到了一個(gè)轉(zhuǎn)折點(diǎn)。產(chǎn)業(yè)界已經(jīng)藉由許多工作體會(huì)到合作的好處，此一正在發(fā)展的伙伴關(guān)系，將把3D芯片整合技術(shù)推向下一個(gè)階段，讓業(yè)界充分了解相關(guān)技術(shù)為半導(dǎo)體制造與設(shè)計(jì)領(lǐng)域帶來(lái)的商機(jī)潛力。

Sematech的3DEC在2010年12月成立以來(lái)，專(zhuān)注于為具成本效益的TSV制程3D芯片解決方案，推動(dòng)建立橫跨整個(gè)產(chǎn)業(yè)的支持生態(tài)系統(tǒng)。查詢(xún)進(jìn)一步信息，請(qǐng)?jiān)L問(wèn)官方網(wǎng)站http://www.sematech.org/corporate/index.htm。
 
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SEMATECH Forum Promotes 3D Interconnect Standards Development
Online information sharing solution enables 3D IC industry to define and track the development of high-volume manufacturing standards

ALBANY, N.Y. (November 7, 2011) – SEMATECH today announced a new online 3D Standards Dashboard solution to help meet the demand for an open, centralized forum for members of the 3D interconnect community to discuss and exchange information on standards activities. The 3D Standards Dashboard aims to promote the development of standards and encourage widespread participation in standardization efforts for heterogeneous 3D integration. Standards development organizations (SDOs) participating in the 3D Dashboard include IEEE Standards Association, JEDEC, SEMI, and Si2.

Due to the tremendous benefits of higher performance, increased functionality, and cost reduction, adoption of 3D integration is rapidly spreading to a wide variety of companies across the semiconductor and MEMS industries. Despite its high potential, a lack of uniform standards and a limited understanding of key manufacturing parameters threaten to delay introduction of high-volume products.

The set of standards required by the industry are broad in scope and standardization activities span many different groups, resulting in a very large and complex standards landscape. The challenge for the standardization community is to improve information sharing of standardization processes to accelerate the development and adoption of 3D standards.

The 3D Standards Dashboard, initiated and managed by SEMATECH’s 3D Enablement Center, provides a definitive resource that enables information sharing and communication of 3D standard activities across the supply chain.  Companies involved in 3D production can use the 3D Standards Dashboard to find existing standards as well as to identify and track standards development activities in areas such as design, testing and production. Additionally, the 3D Standards Dashboard provides a proactive forum for facilitating collaborative discussions on perceived gaps in standardization activities and for identifying which SDO will best meet the need for a specific standardization activity.

“The development and adoption of 3D standards to ensure interoperability will require collaboration and participation across the supply chain, particularly more communication and information sharing between the design, test, and manufacturing communities,” said Larry Smith, 3D Enablement Center manager. “The main objective of the 3D Standards Dashboard is to have a public and centralized forum for SDOs involved in standards development to identify risk areas and determine gaps related to all necessary standards for 3D interconnects.”

“Testing the dies and interconnects of a stacked IC requires an orchestrated test access architecture that spans across the entire stack, but for which the design-for-test (DfT) features need to be implemented by the individual die makers,” said Erik Jan Marinissen, principal scientist at Imec in Leuven, Belgium, and chair of the IEEE P1838TM Working Group which aims to standardize a test access architecture for three-dimensional stacked integrated circuits. “Through its Test Technology Standards Committee, IEEE is already home to many popular DfT standards, such as IEEE 1149.1TM and IEEE 1500TM. Hence, it is a natural continuation to develop the extension of chip DfT for the 3D domain under the umbrella of IEEE.”

“Several JEDEC committees and task groups covering a broad range of technologies have invested years of effort in laying the groundwork for 3D IC standards. With interest in 3D IC technology reaching an all-time high, JEDEC is delighted to partner with SEMATECH and other SDOs to inform the industry of ongoing efforts, and to help facilitate the wide range of standards needed to enable and grow the market for this critical technology,” said John Kelly, JEDEC president.

"Given the urgent need to develop the standards that will enable high-volume, cost-competitive manufacturing of 3D-ICs, it is critical to avoid duplication of efforts between SDOs,” said Paul Triosenior manager, NA Standards Operations, SEMI North America. “SEMI will be frequently updating its 3D-IC manufacturing standards efforts on the dashboard, ensuring that the industry is kept aware of our progress."

“Si2 is pleased to participate in this SEMATECH activity, “says Sumit DasGupta, senior vice president of Engineering, Si2. “We have been working with these industry groups to ensure that all the differently-focused efforts in the complex development of 3D ICs are addressing each group’s area of specific expertise. We see the SEMATECH Standards Dashboard as an excellent way to show the industry how these organizations can work together to ensure all the issues involved in 3D IC design and manufacturing are addressed in a timely manner.”

SEMATECH, IEEE, JEDEC, SEMI, and Si2 invite fabless, fab-lite and IDM companies, outsourced semiconductor assembly and test (OSAT) suppliers, and EDA process tool and materials suppliers worldwide to participate by visiting http://wiki.sematech.org/3D-Standards.

About the IEEE Standards Association
The IEEE Standards Association, a globally recognized standards-setting body within IEEE, develops consensus standards through an open process that engages industry and brings together a broad stakeholder community. IEEE standards set specifications and best practices based on current scientific and technological knowledge. The IEEE-SA has a portfolio of over 900 active standards and more than 500 standards under development. For more information see the IEEE-SA website.

About JEDEC
JEDEC is the leading developer of standards for the microelectronics industry.  Over 3,000 participants, appointed by nearly 300 companies, work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge. For more information, visit www.jedec.org.

About SEMI
SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. SEMI member companies are the engine of the future, enabling smarter, faster, and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets, and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

About Si2
Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 23rd year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents nearly 100 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org.

About SEMATECH’s 3D Enablement Center
In 2010, SEMATECH teamed with the SIA and SRC to establish the 3D Enablement Center–a first-of-its-kind effort to drive industry standardization efforts and technical specifications for heterogeneous 3D integration. The Enablement Center plays a strategic role by providing the necessary infrastructure for the entire industry to leverage 3D packaging technology for innovative new applications.