開放互聯(lián)聯(lián)盟(Open Interconnect Consortium,OIC)由英特爾(Intel)、三星(Samsung)、戴爾(Dell)、博通(Broadcom)、Atmel、Wind River六家公司于2014年7月8日聯(lián)合成立。其宗旨是改進物聯(lián)網(wǎng)(IoT)上幾十億設(shè)備之間的互操作性,定義連接要求。
OIC致力于定義基于工業(yè)標(biāo)準(zhǔn)技術(shù)的公共通訊框架,規(guī)范個人計算和新興IoT設(shè)備之間的無線連接和智能管理信息流程,而不用考慮這些設(shè)備的形狀、操作系統(tǒng)和服務(wù)供應(yīng)商。查詢進一步信息,請訪問官方網(wǎng)站http://www.openinterconnect.org。
About Open Interconnect Consortium
The Open Interconnect Consortium, an Oregon non-profit corporation, is being founded by leading technology companies with the goal of defining the connectivity requirements and ensuring interoperability of the billions of devices that will make up the emerging Internet of Things (IOT). To learn more, visit www.openinterconnect.org or email info@openinterconnect.org.
1. International Data Corporation expects the installed base of the Internet of Things will be approximately 212 billion "things" globally by the end of 2020. This is expected to include 30.1 billion installed "connected (autonomous) things" in 2020. (Source: “The Internet of Things Is Poised to Change Everything, Says IDC,” Oct, 2013)
Intel is a trademark of Intel Corporation in the United States and other countries. Other names and brands may be claimed as the property of others.