JIS B 0651-1996 Surface texture - Instruments for the assessment of surface texture - Profile method
JIS C 2110-1994 固體電氣絕緣材料的絕緣耐力的試驗(yàn)方法
JIS C 2318-1997 Polyethylene terephthalate (PET) films for electrical purposes
JIS C 5010-1994 General rules for printed wiring boards 印制線路板通則
JIS C 5012-1993 Test methods for printed wring boards 印制線路板測(cè)試方法
JIS C 5013-1996 Single and double sided printed wiring boards 單雙面印制線路板
JIS C 5014-1994 Multilayer printed wiring boards 多層印制線路板
JIS C 5016-1994 Test methods for flexible printed wring boards 撓性印制線路板測(cè)試方法
JIS C 5017-1994 Flexible printed wiring boards-Single-sided, Double-sided 單雙面撓性印制線路板
JIS C 5603-1993 Terms and definitions for printed circuits 印制電路術(shù)語(yǔ)及定義
JIS K 5902-1969 日本工業(yè)規(guī)格
JIS C 6471-1995 Test methods of copper-clad laminates for flexible printed wring boards 撓性印制線路板用覆銅箔層壓板測(cè)試方法
JIS C 6472-1995 Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film) 撓性印制線路板用覆銅箔層壓板（聚酯薄膜、聚酰亞胺）
JIS C 6480-1994 General rules of copper-clad laminates for printed wiring boards 印制線路板用覆銅箔層壓板通則
JIS C 6481-1996 Test methods of copper-clad laminates for printed wring boards 印制線路板用覆銅箔層壓板測(cè)試方法
JIS C 6482-1997 Copper-clad laminates for printed wiring boards--Paper base, epoxy resin 印制線路板用覆銅箔層壓板--環(huán)氧樹(shù)脂紙基材
JIS C 6483-1997 Copper-clad laminates for printed wiring boards--Synthetic fiber fabric base, epoxy resin 印制線路板用覆銅箔層壓板--環(huán)氧樹(shù)脂合成纖維布基材
JIS C 6484-1997 Copper-clad laminates for printed wiring boards--Glass fabric base, epoxy resin 印制線路板用覆銅箔層壓板--環(huán)氧樹(shù)脂玻璃布基材
JIS C 6485-1997 Copper-clad laminates for printed wiring boards--Paper base, phenolic resin 印制線路板用覆銅箔層壓板--酚醛樹(shù)脂紙基材
JIS C 6486-1996 Thin copper-clad laminates for multilayer printed wiring boards--Glass fabric base, epoxy resin 多層印制線路板用覆薄銅層壓板--環(huán)氧樹(shù)脂玻璃布基材
JIS C 6488-1999 Base materials for printed circuits--Epoxide cellulose paper core, epoxide glass colth surfaces copper-clad laminated sheet of defined flammability(vertical burning test)
JIS C 6489-1994 Base materials for printed circuits--Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6489-1999 Base materials for printed circuits--Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6490-1998 Base materials for printed circuits--Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6492-1998 Base materials for printed circuits--Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6493-1999 Base materials for printed circuits--Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards JIS C 6494-1999 Base materials for printed circuits--Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
JIS C 6515-1998(IEC 61249-5-1-1995) Copper foil for printed wiring boards 印制線路板用銅箔 （英）（日）
JIS C 6520-1993 General rules of prepreg for multilayer printed wiring boards 多層印制板用半固化片通用規(guī)則
JIS C 6521-1996 Test methods of prepreg for multilayer printed wiring boards 多層印制線路板用半固化片測(cè)試方法
JIS C 6522-1996 Prepreg for multilayer printed wiring boards-Epoxy resin-impregnated glass cloth 多層印制線路板用半固化片--浸環(huán)氧樹(shù)脂玻璃布
JIS C 6523-1995 Prepreg for multilayer printed wiring boards-Modified or unmodified polyimide resin-impregnated glass cloth 多層印制線路板用半固化片--預(yù)浸改良或未改良的聚酰亞胺樹(shù)脂的玻璃布
JIS C 6524-1995 Prepreg for multilayer printed wiring boards-Bismaleimide/Triazine/Epoxide resin-impregnated glass cloth 多層印制線路板用半固化片
JIS B 7507-1993 Vernier,dial and digital callipers
JIS B 7516-1987 Metal rules
JIS B 7536-1982 Electrical Comparators
JIS P 8115-2001 紙及び板紙-耐折強(qiáng)さ試驗(yàn)方法－MIT 試驗(yàn)機(jī)法

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