WECC-2315 Design Guide for high Density Interconnect(HDI) and Microvias
WECC-4104 Specification for High Density Interconnect(HDI) and Microvia Materials
WECC-6202 Performance Guide Manual for Single -and Double -Sided Flexible Printed Wiring Boards
WECC-6801 Terms and Definitions,Test Methods,and Design Examples for Build -Up/High Density Interconnect (HDI) Printed Wiring Boards
UL796 Standard for Safety Printed-Wiring Boards （2003.02）第八版 印制線路板安全標(biāo)準(zhǔn)
QB/T 3819-1999 輕工產(chǎn)品金屬鍍層化學(xué)處理層的厚度測試方法 β射線反向散射法
JB/T 5466-91 高阻計
JB/T 10014-1999 數(shù)顯電感測微儀
SJ/T 9545-93 有金屬化孔的單、雙面印制板的質(zhì)量分等標(biāo)準(zhǔn)
SJ/T 10188-91 印制板安裝用元器件的設(shè)計和使用指南
SJ/T 10309-92 印制板用阻焊劑
SJ/T 10329-92 印制板返修、修理和修改
SJ/T 10389-93 印制板的包裝、運輸和保管
SJ/T 10565-94 印制板組裝件裝聯(lián)技術(shù)要求
SJ/T 10666-1995 表面組裝組件的焊點質(zhì)量評定
SJ/T 10668-2002 表面組裝技術(shù)術(shù)語
SJ/T 10669-1995 表面組裝元器件可焊性試驗
SJ/T 10670-1995 表面組裝工藝通用技術(shù)要求
SJ/T 10715-1996 無金屬化孔單雙面印制板能力詳細(xì)規(guī)范
SJ/T 10716-1996 有金屬化孔單雙面印制板能力詳細(xì)規(guī)范 
SJ/T 11282-2003 印制板用“E”玻璃纖維紙規(guī)范
SJ/T 11283-2003 印制板用處理“E”玻璃纖維布規(guī)范
SJ 20439-94 印制底板組裝件設(shè)計要求
SJ 20532-95 印制底板組裝件通用規(guī)范 
SJ 20604-96 撓性和剛撓印制板總規(guī)范
SJ 20632-97 印制板組裝件總規(guī)范
SJ 20810-2002 印制板尺寸與公差
SJ 20828-2002 合格鑒定用測試圖形和布設(shè)總圖
SJ 20846-2002 電鍍用氰化亞金鉀規(guī)范
SJ 20857-2002 電阻箔復(fù)合材料規(guī)范
SJ 20896-2003 印制電路板組件裝焊后的潔凈度檢測及分級
SJ 52142/2-2003 覆銅箔聚苯醚玻纖布層壓板詳細(xì)規(guī)范
GJB/Z 51.1-93 軍用濾波器和網(wǎng)絡(luò)系列型譜 電磁/射頻干擾濾波器
GJB 1651-93 印制電路用覆金屬箔層壓板試驗方法
GJB 2142-94 印制線路板用覆金屬箔層壓板總規(guī)范
GJB 2142/1-95 耐熱阻燃型覆銅箔環(huán)氧玻璃布層壓板詳細(xì)規(guī)范
GJB 2830-97 撓性和剛撓印制板設(shè)計要求
GJB 362A-96 剛性印制板總規(guī)范
GJB 4057-2000 軍用電子設(shè)備印制電路板設(shè)計要求
GJB 4896-2003 軍用電子設(shè)備印制電路板驗收判據(jù) 
IEC 674-2 Commission Electrotechnique Internationale International Electrotechnical Commission
IEC 60194 Printed board design, manufacture and assembly-Terms and definitions
IEC 60326-2 Printed boards Part 2: Test methods
IEC 61189-2 Test methods for electrical materials, interconnection structures and assemblies- Part 2: Test methods for materials for interconnection structures
IEC 61189-3 Test methods for electrical materials, interconnection structures and assemblies- Part 3: Test methods for interconnection structures (Printed boards)
IEC 61249-5-4 Materials for interconnection structures- Part 5: Sectional specification set for conductive foils and films with or without coatings- Section 4: Conductive inks 
IEC 61249-8-8 Materials for interconnection structures- Part 8: Sectional specification set for non-conductive films and coatings- Section 8: Temporary polymer coatings
IEC 62326-1 Printed boards- Part 1: Generic specification
IEC 62326-1 Printed boards- Part 1: Generic specification
IEC 62326-4 (1996-12 ) Printed boards-Part 4: Rigid multilayer printed boards with interlayer connections-Sectional specification 
IEC 62326-4-1 (1996-12 ) Printed boards-Part 4: Rigid multilayer printed boards with interlayer connections-Section specification-Section 1: Capability Detail Specification-Performance levels A,B and C
MIL-PRF-31032 Printed Circuit Board/Printed Wiring Board,General Specification For
MIL-PRF-31032/1A Printed Wiring Board, Rigid ,Multilayered 
MIL-PRF-31032/2 Printed wiring Board, Rigid ,Single and bouble layer.Woven E-Glass Reinforced Thermosetting Resin Base Material, With or Without Plated Holes ,For Soldered Part Mounting
MIL-PRF-55110F PRINTED WIRING BOAD ,RIGID GENGRAL SPECIPICATION FOR

更多PCB標(biāo)準(zhǔn)信息，請訪問http://www.cpca.org.cn/partition/partition_7/partition_7.asp。