IPC-TR-470
 Thermal Characteristics of Multilayer Interconnection Boards (多層互連板的熱特性)
 1/74 (orig. pub.)
 
IPC-TR-474
 An Overview of Discrete Wiring Techniques (分立線路綜觀)
 3/79 (orig. pub.) Reprint 1984
 
IPC-TR-476
 How to Avoid Metallic Growth Problems on Electronic Hardware (如何避免電子硬件的合金化生長(zhǎng))
 9/77 (orig. pub.) A 6/84
 
IPC-TR-480 (作廢)
 Results of Multilayer Test Program Round Robin IV Phase I
 9/75 (orig. pub.)
 
IPC-TR-481
 Results of Multilayer Test Program Round Robin V (多層V循環(huán)測(cè)試程序的結(jié)果)
 4/81 (orig. pub.)
 
IPC-TR-483
 Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program (薄層壓板尺寸穩(wěn)定性測(cè)試 )
 4/84 (orig. pub.) 10/87 Addendums Revised 3/91
 
IPC-TR-484
 Results of IPC Cooper Foil Ductility Round Robin Study (IPC Cooper 箔延展性研究聯(lián)合報(bào)告)
 4/86 (orig. pub.)
 
IPC-TR-485
 Results of Cooper Foil Rupture Strength Test Round Robin Study (Cooper 箔斷裂強(qiáng)度研究聯(lián)合報(bào)告)
 3/85 (orig. pub.)
 
IPC-TR-549
 Measles in Printed Wiring Boards (印制板內(nèi)的粉點(diǎn))
 11/73 (orig. pub.)
 
IPC-TR-551
 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components (電子元件安裝互連印制板的質(zhì)量評(píng)定)
 7/93 (orig. pub.)
 
IPC-DR-570
 General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards (1/8英寸印制板硬質(zhì)合金鉆頭總技術(shù)規(guī)范)
 1/79 (orig. pub.) A 4/84
 
IPC-DR-572
 Drilling Guidelines for Printed Boards (印制板鉆孔指南)
 4/88 (orig. pub.)
 
IPC-TR-576(已作廢)
 Additive Process Evaluation
 9/77 (orig. pub.)
 
IPC-TR-578
 Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards (前沿制造技術(shù)報(bào)告)
 9/84 (orig. pub.)
 
IPC-TR-579
 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards (印制板小孔金屬化可靠性評(píng)估聯(lián)合報(bào)告)
 9/88 (orig. pub.)
 
IPC-TR-580
 Cleaning and Cleanliness Test Program Phase 1 Test Results (清洗和潔凈度測(cè)試程序第1階段測(cè)試結(jié)果)
 10/89 (orig. pub.)
 
IPC-TR-581
 IPC Phase 3 Controlled Atmosphere Soldering Study IPC Phase 3 可控氣氛焊接研究)
 8/94 (orig. pub.)
 
IPC-TR-582
 IPC Phase 3 No-Clean Flux Study (IPC Phase 3免洗助焊劑研究)
 11/94 (orig pub.)
 
IPC-A-600
 Acceptability of Printed Boards (印制 板可接收條件)
 orig pub. '64 A '70 B '74 C '78 D '89 E 8/95 F 11/99
 
IPC-QE-605A
 Printed Board Quality Evaluation Handbook (印制板質(zhì)量評(píng)定手冊(cè))
 Revision A: 2/99
 
IPC-SS-605
 Printed Board Quality Evaluation Slide Set (印制板質(zhì)量評(píng)定,幻燈片)  
 
IPC-A-610
 Acceptability of Electronic Assemblies

(電子組裝的可接收條件)
 8/83 (orig. pub.) 2nd printing 1/86 3rd printing 5/88 A 3/90 B 12/94 Amendment 1/96 Revision C: 1/00
 
IPC-QE-615
 Assembly Quality Evaluation Handbook (組裝質(zhì)量評(píng)定手冊(cè))
 3/93 (orig. pub.)
 
IPC-SS-615
 Assembly Quality Evaluation Slide Set (組裝質(zhì)量評(píng)定,幻燈片)
 3/93 (orig. pub.) Revision A: 2/99
 
IPC-AI-640 (已作廢)
 User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates
 1/87 (orig. pub.)
 
IPC-AI-641
 User's Guidelines for Automated Solder Joint Inspection (自動(dòng)焊點(diǎn)檢查用戶指南)
 1/87 (orig. pub.)
 
IPC-AI-642
 User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's (照相底圖,內(nèi)層和PCB裸板自動(dòng)檢查用戶指南)
 10/88 (orig. pub.)
 
IPC-OI-645
 Standard for Visual Optical Inspection Aids (光學(xué)檢查目測(cè)標(biāo)準(zhǔn))
 10/93 (orig. pub.)
 
IPC-TM-650
 Test Methods Manual (測(cè)試方法手冊(cè))
 Updated per test method
 
IPC-ET-652
 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards (PCB裸板電氣測(cè)試要求和導(dǎo)則)
 10/90 (orig. pub.)
 
IPC-QL-653
 Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material (檢查/測(cè)試印制板,元件和材料的設(shè)備鑒定)
 8/88 (orig. pub.) A 11/97
 
IPC-MI-660
 Incoming Inspection of Raw Materials Manual (原材料來(lái)料檢查手冊(cè))
 2/84 (orig. pub.)
 
IPC-R-700C 被 IPC-7711/ 7721替代
 Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies
 9/67 (orig. pub.) A 12/71 B 9/77 C 1/88
 
IPC-TA-720
 Technology Assessment Handbook on Laminates (層壓板技術(shù)評(píng)估手冊(cè))
 
IPC-TA-721
 Technology Assessment Handbook on Multilayer Boards (多層板技術(shù)評(píng)估手冊(cè))  
 
IPC-TA-722
 Technology Assessment of Soldering (焊接技術(shù)評(píng)估)  
 
IPC-TA-723
 Technology Assessment Handbook on Surface Mounting (表面組裝技術(shù)評(píng)估手冊(cè))  
 
IPC-TA-724
 Technology Assessment Series on Cleanrooms (凈化間技術(shù)評(píng)估)
 4/98
 
IPC-PE-740
 Troubleshooting Guide for Printed Board Manufacture and Assembly (印制板制造及組裝故障修理指南)
 1/85 (orig pub.)
A 12/97
 
IPC-CM-770
 Printed Board Component Mounting (印制板元件安裝)
 9/68 (orig. pub.) A 3/76 B 10/80 C 1/87 D 1/96
 
IPC-SM-780
 Component Packaging and Interconnecting with Emphasis on Surface Mounting (片式元件SMC的封裝和互連)
 3/88 (orig. pub.)
 
IPC-SM-782
 Surface Mount Design and Land Pattern Standard (表面組裝設(shè)計(jì)和焊盤(pán)圖形標(biāo)準(zhǔn))
 3/87 (orig. pub.) 9/89 A 8/93 Amendment 1 10/96
 
IPC-EM-782
 Surface Mount Design and Land Pattern Spreadsheet (表面組裝設(shè)計(jì)和焊盤(pán)圖形電子表格)
 9/94 (orig. pub.) Addendum 12/95
 
IPC-SM-784
 Guidelines for Chip-on-Board Technology Implementation (COB技術(shù)應(yīng)用指南)
 11/90 (orig. pub.)
 
IPC-SM-785
 Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments (表面組裝焊接可靠性加速試驗(yàn)指南)
 11/92 (orig. pub.)
 
IPC-SM-786已被 J-STD-020替代
 Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs
 12/90 (orig. pub.) A 1/95
 
IPC-MC-790
 Guidelines for Multichip Module Technology Utilization (多芯片模塊技術(shù)應(yīng)用指南)
 8/92 (orig. pub.)
 
IPC-S-804被 J-STD-003替代
 Solderability Test Methods for Printed Wiring Boards
 1/82 (orig. pub.) A 1/87
 
IPC-S-805被 J-STD-002替代
 Solderability Tests for Component Leads and Terminations
 1/85 (orig. pub.)
 
IPC-MS-810
 Guidelines for High Volume Microsection (顯微切面指南)
 10/93 (orig. pub.)
 
IPC-S-815被 J-STD-001替代
 General Requirements for Soldering Electronic Interconnections (已廢除,由J-STD-001替代)
 11/77 (orig. pub.) A 6/81 B 12/87
 
IPC-S-816
 SMT Process Guideline and Checklist ( SMT工藝指南和檢查表)
 7/93 (orig. pub.)
 
IPC-SM-817
 General Requirements for Dielectric Surface Mounting Adhesives (絕緣性表面組裝膠粘劑通用規(guī)范)
 11/89 (orig. pub.)
 
IPC-SF-818 被 J-STD-004替代
 General Requirement for Electronic Soldering Fluxes (用于電子組件焊接的助焊劑通用技術(shù)要求)
 2/88 (orig. pub.) 12/91
 
IPC-SP-819 被J-STD-005替代
 General Requirements and Test Methods for Electronic Grade Solder Paste
 10/88 (orig. pub.)
 
IPC-AJ-820
 Assembly and Joining Manual (組裝和連接手冊(cè))
 8/96 (orig. pub.)
 
IPC-CA-821
 General Requirements for Thermally Conductive Adhesives (熱導(dǎo)膠粘劑通用技術(shù)要求)
 1/95 (orig. pub.)
 
IPC-CC-830
 Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies (印制板組裝電絕緣材料的鑒定和性能)
 1/84 (orig. pub.) 4/90 Reaffirmed A 10/98
 
IPC-SM-839
 Pre and Post Solder Mask Application Cleaning Guidelines (焊接前,后阻焊膜的清洗指南)
 4/90 (orig. pub.)
 
IPC-SM-840
 Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards (印制板阻焊膜的鑒定和性能)
 11/77 (orig. pub.) A 7/83 B 5/88 C 1/96
 
IPC-H-855 (己作廢)
 Hybrid Microcircuit Design Guide
 10/82 (orig. pub.)
 
IPC-D-859
 Design Standard for Thick Film Multilayer Hybrid Circuits (厚膜多層混合電路設(shè)計(jì)標(biāo)準(zhǔn))
 12/89 (orig. pub.)
 
IPC-HM-860
 Specification for Multilayer Hybrid Circuits (多層厚膜電路技術(shù)規(guī)范)
 1/87 (orig. pub.)
 
IPC-TF-870
 Qualification and Performance of Polymer Thick Film Printed Boards (聚合物厚膜印制板的鑒定和性能)
 11/89 (orig. pub.)
 
IPC-D-949被IPC-D-275替代
 Design Standard for Rigid Multilayer Printed Boards
 1/87 (orig. pub.)
 
IPC-ML-950被 IPC-RB-276替代
 Performance Specification for Rigid Multilayer Printed Boards
 1/66 (orig. pub.) A 9/70 B 12/77 C 11/86
 
IPC-ML-960
 Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards (多層印制板預(yù)制內(nèi)層敷箔板的鑒定和性能規(guī)范)
 7/94 (orig. pub.)
 
IPC-ML-975 被IPC-D-325替代
 End Product Documentation Specification for Multilayer Printed Wiring Boards
 9/69 (orig. pub.)
 
IPC-ML-990 (作廢)
 Performance Specification for Flexible Multilayer Wiring
 9/72 (orig. pub.)
 
IPC-1402/IPC-H-855
 Hybrid Microcircuit Design Guide (混合微波電路設(shè)計(jì)指南)
 10/82 (orig. pub.)
 
IPC-1710
 OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP印制板OEM制造商資格鑒定一覽表)
 2/94 (orig. pub.) 12/97 updated
 
IPC-1720
 Assembly Qualification Profile (AQP印制板組裝制造商資格鑒定一覽表)
 7/96 (orig. pub.)
 
IPC-1730
 Laminator Qualification Profile (LQP) (層壓板制造商資格鑒定一覽表)
 1/98
 
IPC-2141
 Controlled Impedance Circuit Boards and High Speed Logic Design (阻抗調(diào)制電路板和高速邏輯電路設(shè)計(jì))
 4/96 (orig. pub.)
 
IPC-2221 代替 IPC-D-275
 Generic Standard on Printed Board Design (印制板設(shè)計(jì)通用標(biāo)準(zhǔn))
 2/98(orig. pub.)
 
IPC-2222 代替 IPC-D-275
 Sectional Design Standard for Rigid Organic Printed Boards (剛性有機(jī)印制板設(shè)計(jì)標(biāo)準(zhǔn))
 2/98(orig. pub.)
 
IPC-2223
 Sectional Design Standard for Flexible Printed Boards (柔性印制板設(shè)計(jì)標(biāo)準(zhǔn))
 11/98
 
IPC-3406
 Guidelines for Electrically Conductive Surface Mount Adhesives (表面組裝導(dǎo)電膠導(dǎo)則)
 7/96 (orig. pub.)
 
IPC-3408
 General Requirements for Anistropically Conductive Adhesive Films (各向異性導(dǎo)電膠粘劑通用技術(shù)要求)
 11/96 (orig.pub.)
 
IPC-4101 代替 IPC-L-108/109 IPC-L-112/115
 Specification for Base Materials for Rigid and Multilayer Boards (剛性及多層印制板基材特性規(guī)范)
 12/97 (orig. pub.)*
 
IPC-4110
 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards (非織物纖維紙印制板的特性和規(guī)格)
 8/98
 
IPC-4130
 Specification and Characterization Methods for Nonwoven "E" Glass Mat (非織物‘E’玻璃墊規(guī)范)
 9/98
 
IPC-6011
 Generic Performance Specification for Printed Boards (印制板通用性能規(guī)范)
 7/96 (orig. pub.)
 
IPC-6012
 Qualification and Performance Specification for Rigid Printed Boards (剛性印制板的鑒定與性能規(guī)范)
 7/96 (orig. pub.) A 10/99
 
IPC-6013
 Qualification and Performance Specification for Flexible Printed Boards (柔性印制板的鑒定與性能規(guī)范)
 11/98
 
IPC-6015
 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures (有機(jī)多芯片模塊(MCM-L)組裝及互連結(jié)構(gòu)的鑒定和性能規(guī)范)
 2/98 (orig. pub.)
 
IPC-6018
 Microwave End Product Board Inspection and Test (微波產(chǎn)品電路板的檢查和測(cè)試)
 1/98(orig. pub.)
 
IPC/JPCA-6202
 Performace Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards (單、雙面柔性印制電路板性能指導(dǎo)手冊(cè))
 2/99
 
IPC-7711 代替 IPC-R-700C
 Rework of Electronic Assemblies (電子組件的返修)
 4/98 (orig. pub.)
 
IPC-7721 代替 IPC-R-700C
 Repair and Modification of Printed Boards and Electronic Assemblies (印制板和電子組件的修理和調(diào)整)
 4/98 (orig. pub.)
 
IPC-9191代替IPC-PC-90
 General Guideline for implementation of Statistical Process Control (SPC) (SPC實(shí)施通則)
 11/99 (orig.pub)
 
IPC-9201
 Surface Insulation Resistance Handbook (表面絕緣電阻手冊(cè))
 7/96 (orig. pub.)
 
IPC-9501
 PWB Assembly Process Simulation for Evaluation of Electronic Components (電子元件組裝工藝仿真的評(píng)價(jià))
 7/95 (orig. pub.) Revision A: In process
 
IPC-9504
 Assembly Process Simulation for Evaluation of Non-IC Components (非IC器件組裝工藝仿真的評(píng)價(jià))
 6/98
 
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